客戶級 SSD
NVMe SSD M.2

BG4 系列為體積輕巧的單一封裝 NVMe™ SSD,容量高達 1,024GB,並採用 PCIe®Gen3x4 通道介面,以及 鎧俠 96 層 TLC BiCS FLASH™。BG4 SSD 具備更高的頻寬,以及更優異的快閃記憶體管理和主機記憶體緩衝 (HMB) 技術,提供單一封裝固態硬體中最佳的讀取效能 (高

達 2,300MB/s 循序讀取和 390K IOPS 隨機讀取),以及高達 3.7W (標準值) 的有效耗電量。

BG4 系列推出 128GB、256GB、512GB 及 1,024GB 四種容量,外型規格選項包括表面黏著 M.2 1620 單一封裝或可拆式 M.2 2230 模組,因此適用於超薄型個人電腦、嵌入式裝置,以及資料中心的伺服器開機等輕薄型系統設計。
BG4 系列具有支援 TCG Opal 2.01 版的自我加密硬碟 (SED) 型號選項。

文件

產品特色

鎧俠 96 層 BiCS FLASH™

PCIe® Gen3 x4,NVMe™

容量高達1,024GB

M.2 1620 單一封裝及 M.2 2230單面外型規格

SED 型號可選用 TCG OPAL 2.01

主要應用

  • 輕薄型個人電腦
  • 二合一筆記型電腦
  • 物聯網/嵌入式裝置
  • 伺服器及儲存陣列開機硬碟

產品規格

表面安裝 M.2 Type 1620 封裝

* 表格可水平捲動。

Base Model NumberKBG40ZPZ1T02KBG40ZPZ512GKBG40ZPZ256GKBG40ZPZ128G
Capacity1,024 GB512 GB256 GB128 GB
Basic Specifications
Form FactorM.2 1620-S3 Single packageM.2 1620-S2 Single package
Connector Type-
lnterfacePCIe® Gen3 x4, NVMe™ 1.3b
Maximum Interface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read2,300 MB/s2,200 MB/s2,000 MB/s
Sequential Write1,800 MB/s1,400 MB/s800 MB/s
Random Read390 K IOPS330 K IOPS200 K IOPS
Random Write200 K IOPS190 K IOPS150 K IOPS
Reliability
MTTF1,500,000 hours
Power Requirements
Supply Voltage3.3 V ± 5 %, 1.8 V ±5 %,1.2 V ±5 %
Power Consumption (Active)3.4 W typ.3.1 W typ.3.2 W typ.3 W typ.
Power Consumption (L1.2 mode)5 mW typ.
Dimensions
Height1.5 mm Max.1.3 mm Max.
Width16.0 mm Max.
length20.0 mm Max.
Weight1.0 g Max.0.85 g Max.
Environmental
Temperature (Operating)0 ~ 85 °C(TSMART)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)-
Shock (Operating/Non-operating)-
More features・Host Memory Buffer feature is supported.
・SLC cache is supported.
・Sanitize command is supported.
可拆卸式 M.2 Type 2230 模組

* 表格可水平捲動。

Base Model NumberKBG40ZNS1T02KBG40ZNS512GKBG40ZNS256GKBG40ZNS128G
Capacity1,024 GB512 GB256 GB128 GB
Basic Specifications
Form FactorM.2 2230-S3 Single-sidedM.2 2230-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® Gen3 x4, NVMe™ 1.3b
lnterface Speed32 GT/s (Gen3 x4)
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read2,300 MB/s2,200 MB/s2,000 MB/s
Sequential Write1,800 MB/s1,400 MB/s800 MB/s
Random Read390 K IOPS330 K IOPS200 K IOPS
Random Write200 K IOPS190 K IOPS150 K IOPS
Reliability
MTTF1,500,000 hours
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)3.7 W typ.3.5 W typ.3.6 W typ.3.4 W typ.
Power Consumption (L1.2 mode)5 mW typ.
Dimensions
Height2.38 mm Max.2.23 mm Max.
Width22.0 mm Max.
length30.0 mm Max.
Weight2.6 g Max.2.5 g Max.
Environmental
Temperature (Operating)0 ~ 85 °C(TSMART)
Temperature(Non-operating)-40 ~ 85 °C
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 10 ~ 2,000 Hz )
Shock (Operating/Non-operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features・Host Memory Buffer feature is supported.
・SLC cache is supported.
・Sanitize command is supported.
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • 1 MB (megabyte) = 1,000,000 bytes.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TSMART : Composite Temperature in SMART/Health Information
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.
  • All information provided here is subject to change without prior notice.

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